The middle layer BGA board for iPhone 11 Pro and iPhone 11 Pro Max is designed for advanced logic board repair involving the dual-layer motherboard structure used in these devices. The iPhone 11 Pro series uses a stacked logic board design, where the upper and lower motherboard layers are connected through BGA solder points.

This replacement middle layer BGA board is used during board-level repair procedures when rebuilding or restoring connectivity between the logic board layers. It is intended for professional technicians performing advanced micro-soldering and motherboard refurbishment.

See all our iPhone 11 Pro parts here.

IMPORTANT NOTICE:
This component requires advanced BGA rework and micro-soldering for installation. It must be installed by experienced technicians using specialised motherboard repair equipment.

Key Features:

• Aftermarket replacement component
• Middle layer BGA board
• Designed for stacked motherboard repair
• Used during logic board layer reconstruction
• Supports advanced board-level repair procedures
• Precision fit for iPhone 11 Pro series

Compatible with:

• A2160 - iPhone 11 Pro
• A2215 - iPhone 11 Pro
• A2217 - iPhone 11 Pro
• A2161 - iPhone 11 Pro Max
• A2220 - iPhone 11 Pro Max
• A2218 - iPhone 11 Pro Max

What's Included:

• 1 x For iPhone 11 Pro - 11 Pro Max - Middle Layer BGA Board

DISCLAIMER: This is an aftermarket replacement part and is not manufactured or endorsed by Apple. Professional installation requiring advanced BGA rework equipment is required.