The Middle Layer BGA Board by Mijing for iPhone XS and iPhone XS Max is a board-level repair component designed for advanced logic board reconstruction. This middle layer interposer board is used during CPU, baseband, or logic board separation repairs where the original BGA layer becomes damaged during rework or data recovery procedures.

Manufactured for precision alignment and signal continuity, this Mijing middle layer board restores the connection pathways between the upper and lower logic board layers. It is an essential solution for high-level micro-soldering technicians performing sandwich board repairs and structural board restoration.

Key Features:

• Middle layer BGA interposer board
• Used for logic board sandwich repairs
• Restores board-to-board connectivity
• Supports CPU and baseband rework
• Precision micro-soldering component
• Brand: Mijing

Compatible with:

• A1920 - iPhone XS
• A2097 - iPhone XS
• A2098 - iPhone XS
• A2100 - iPhone XS
• A1921 - iPhone XS Max
• A2101 - iPhone XS Max
• A2102 - iPhone XS Max
• A2104 - iPhone XS Max

What's Included:

• 1 x For iPhone XS - XS Max - Middle Layer BGA Board - Mijing

IMPORTANT NOTICE:
This component requires micro-soldering for installation. Soldering is required, and the repair should only be carried out by trained micro-soldering technicians with appropriate tools and experience.

DISCLAIMER: Professional board-level repair component. Aftermarket part. Not manufactured or endorsed by Apple.